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Full Auto Pick and Place machine

The Full Auto Pick and Place machine is a standalone Pick & Place system designed primarily for semiconductor applications, capable of high-speed automated handling of units between frames and trays.

 

The machine features dual picker modules with 16 picker pads, a PC-based control system, and advanced vision inspections for comprehensive top, bottom, and side evaluations.

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Machine includes ionizers, multi-tray unloading modules, and supports 8” and 12” ring frame sizes. Additional specifications, such as auto-calibration, SECS/GEM interface, and motor torque control, enhance operational accuracy and ensure consistent unit alignment and inspection.

Full Auto Pick and Place machine

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  • Workable for Frame to Tray

  • Productivity (UPH) : upto 12K (without 6side Inspection) subject to the PKG info.)

  • 8Pad x 2 = 16 Picker Pads

  • 2 Deck Magazine capability

  • Machine direction : Left to right

  • PC Based control

  • Minimized conversion kits applied

  • Vision Inspections (6 Side)

  • Ionizers on specific area

  • Footprint : 2670mm(L)x 1420mm(W)x 1800mm(H) with tube offloader

  • Multiple Jedec Tray module for unloading

  • Applicable Ring frame size: 8” / 12”

  • Applicable Min. unit size : 1.5x1.5 mm

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